Surface Mounting Technology - Part 5-1: Surface Strain On Circuit Boards - Strain Gauge Measurement Applied To Chip Components

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Edition :	1.0
File Size :	1 file , 4.5 MB
ISBN(s) :	9782832281604
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	28
Published :	01/01/2024

IEC/TR 61760-5-1 Ed. 1.0 en:2024 PDF

Surface Mounting Technology - Part 5-1: Surface Strain On Circuit Boards - Strain Gauge Measurement Applied To Chip Components

History

Related products

Best-Selling Products